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Key Milestones
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2008
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Incorporated a new subsidiary - Kunshan Sandi 3D-Circuit Technology Co Ltd for manufacture and sales of 3D-MID related products;
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Incorporated a new subsidiary - Windsor Manganese (Yongzhou) Co Ltd for manufacture of silicon manganese project;
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Awarded "Singapore 1000 Company 2008" by DP Information Group;
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Incorporated a new subsidiary - Windsor Manganese Ltd for establishment of manufacturing facilities in Yongzhou for silicon manganese project.
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2007
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Incorporated a new subsidiary - Hong Kong 3D-Circuit Ltd for establishment of manufacturing facilities in Kunshan for 3D-MID (three dimensional - moulded interconnect devices) related products;
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Investment in a Taiwan Joint Venture - Taiwan 3D-Circuit Industrial Co Ltd
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2006
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Incorporated a new subsidiary - Iwasa Windsor Precision Mould (Wuhan) Co Ltd for fulfilling customers needs in Wuhan;
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Incorporated a new subsidiary - Kunshan Lun Hsing Electronics Technologies Ltd in March for expansion of punching services;
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Listed on SGX Mainboard on 10 April;
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2005
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Incorporate Singapore Windsor Holdings Private Ltd in Singapore for group restructuring in our IPO exercise.
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2002
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Incorporated Guozhou Windsor Ltd in April with our Taiwanese partners to capitalize on the growing demand for the outsourcing of punching services.
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2000
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Incorporated Iwasa Windsor Co Ltd in August with our Japanese partners for fulfilling the growing trend of Japanese manufacturers moving their manufacturing process of high-end telecommunication and consumer electronics products into the PRC.
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1999
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Successfully made our first foray into the European market and secured orders from customers in France, Spain and the UK via the appointment of sales agents.
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1997
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Acquired Lun Hsing Machinery (Kunshan) Co Ltd in July for extending our service to the Taiwanese customers whom has set up their manufacturing facilities in the Eastern China.
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1993
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Incorporated Goodbase Overseas Ltd in July for catching the next wave in the production of high end PCB punching moulds, thereby further invested newer equipments to enhance our existing production technology and improve product quality;
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Incorporated Shenzhen National Chance Metal Manufacture Co Ltd in August for manufacturing of simple PCB punching moulds before realigning it in mid 1990s to provide quality mould bases for die-casting and plastic injection moulds;
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Shifted to our existing manufacturing facilities in Shajing Town with a total built-in area of approximately 5,000 square metres so as to consolidate our operations in December;
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1987
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Incorporated National Chance Ltd to provide electroplating services to our customers tapping on the trend of outsourcing of such services to us by our PCB manufacturers owing to tighter environmental regulations from the electroplating operations.
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1986
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Established Windsor Metal Manufacture Co by our founders Michael Chung and Hugo Chung to supply PCB punching moulds to PCB manufacturers with the first production facility located in the Shenzhen Special Economic Zone.
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